Wei Chen, L. ., Seng Hua, L. ., Antov, P., Lubis, M. A. R., Kristak, L., & Hrusovsky, D. (2023). Effects of Particles Moisture, Conditioning Environment, and Heat Treatment on the Formaldehyde Emission of Urea Formaldehyde-Bonded Particleboard. Bioresources and Environment, 1(2), 1–11. https://doi.org/10.24191/bioenv.v1i2.27